Process Variations and Probabilistic Integrated Circuit Design
Uncertainty in key parameters within a chip and between different chips in the deep sub micron era plays a more and more important role. As a result, manufacturing process spreads need to be considered during the design process. Quantitative methodo
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Manfred Dietrich • Joachim Haase Editors
Process Variations and Probabilistic Integrated Circuit Design
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Editors Manfred Dietrich Design Automation Division EAS Fraunhofer-Institut Integrierte Schaltungen Zeunerstr. 38, 01069 Dresden Germany [email protected]
Joachim Haase Design Automation Division EAS Fraunhofer-Institut Integrierte Schaltungen Zeunerstr. 38, 01069 Dresden Germany [email protected]
ISBN 978-1-4419-6620-9 e-ISBN 978-1-4419-6621-6 DOI 10.1007/978-1-4419-6621-6 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2011940313 © Springer Science+Business Media, LLC 2012 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Preface
Continued advances in semiconductor technology play a fundamental role in fueling every aspect of innovation in those industries in which electronics is used. In particular, one cannot fail to appreciate the benefits these advances offer in either reducing the dimensions into which an electronic system can be built or increasing the sheer complexity and overall functionality of the individual circuits. In general, industry tends more to take advantage of the opportunity of offering additional features and capability within a given space that reducing the overall size. Whereas the manufacturing industry has matched the advances in the semiconductor industry so that failure rates during fabrication at each stage have been maintained at the same rate per element, the number of elements has increased astronomically. As a result, unless measures are not taken, the overall failure rates during production will increase dramatically. There are certain factors that will compound this trend, for example the fact that semiconductor technology yields may be a function of factors other than simple manufacturing ability and may become unacceptable as functional density increases. It is thus essential to investigate which parameters of the various manufacturing processes are the most sensitive in the production failure equation, and to explore how their influence can be reduced. If one focuses on the integrated circuit itself, one might consider either addressing the parameters associated with the silicon processing, the disciplines involved in the desi
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