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Design and Crosstalk Analysis in Carbon Nanotube Interconnects

Design and Crosstalk Analysis in Carbon Nanotube Interconnects

P. Uma Sathyakam Partha Sharathi Mallick •

Design and Crosstalk Analysis in Carbon Nanotube Interconnects

123

P. Uma Sathyakam School of Electrical Engineering Vellore Institute of Technology Vellore, India

Partha Sharathi Mallick School of Electrical Engineering Vellore Institute of Technology Vellore, India

ISBN 978-981-15-8887-7 ISBN 978-981-15-8888-4 https://doi.org/10.1007/978-981-15-8888-4

(eBook)

© The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2021 This work is subject to copyright. All rights are solely and exclusively licensed by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, expressed or implied, with respect to the material contained herein or for any errors or omissions that may have been made. The publisher remains neutral with regard to jurisdictional claims in published maps and institutional affiliations. This Springer imprint is published by the registered company Springer Nature Singapore Pte Ltd. The registered company address is: 152 Beach Road, #21-01/04 Gateway East, Singapore 189721, Singapore

Preface

Scaling down of transistors in integrated circuits is inevitable to improve the speed and reduce power consumption. While scaling down of transistors proved to be beneficial, interconnect scaling in ICs led to many reliability problems. Slowly, the performance-defining factor of an IC has clearly moved from transistors to interconnects over the last decade. Currently, copper (Cu) is used as interconnect material in ICs up to 14 nm technology node. However, beyond this node size, Cu can no more be used as it suffers from electromigration, crosstalk, high resistivity, high RC delay and self-heating. So, alternate materials like carbon nanotubes (CNTs) and graphene nanoribbons (GNRs) are proposed as interconnects and widely studied in the past 10 years. Based on modelling and SPICE simulations, both CNTs and GNRs are found to be excellent replacement to Cu interconnects to connect nanoscale devices in ICs. This book examines the crosstalk an