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33.1 Introduction to MEMS............................ 985 33.2 Introduction to NEMS ............................ 988 33.3 Tribological Issues in MEMS/NEMS ........... 33.3.1 MEMS......................................... 33.3.2 NEMS ......................................... 33.3.3 Tribological Needs .......................

989 989 994 995

33.4 Tribological Studies of Silicon and Related Materials ........................... 995 33.4.1 Tribological Properties of Silicon and the Effect of Ion Implantation 996 33.4.2 Effect of Oxide Films on Tribological Properties of Silicon.................................... 998 33.4.3 Tribological Properties of Polysilicon Films and SiC Film.... 1000 33.5 Lubrication Studies for MEMS/NEMS ........ 1003 33.5.1 Perfluoropolyether Lubricants ....... 1003 33.5.2 Self-Assembled Monolayers (SAMs) 1004 33.5.3 Hard Diamond-like Carbon (DLC) Coatings ..................................... 1008 33.6 Component-Level Studies ...................... 1009 33.6.1 Surface Roughness Studies of Micromotor Components .......... 1009 33.6.2 Adhesion Measurements .............. 1011 33.6.3 Static Friction Force (Stiction) Measurements in MEMS................ 1014 33.6.4 Mechanisms Associated with Observed Stiction Phenomena in Micromotors ........................... 1016 References .................................................. 1017

considerably with humidity. A bonded layer of perfluoropolyether lubricant is found to satisfactorily reduce the friction forces in the micromotor. AFM/FFM-based techniques can be satisfactorily used to study and evaluate micro/nanoscale tribological phenomena related to MEMS/NEMS devices. This chapter presents a review of macro- and micro/nanoscale tribological studies of materials and lubrication studies for MEMS/NEMS and component-level studies of stiction phenomena in MEMS/NEMS devices.

Part E 33

Micro/Nanotri

984

Part E

Industrial Applications and Microdevice Reliability

Part E 33

Microelectromechanical systems (MEMS) refer to microscopic devices that have a characteristic length of less than 1 mm but more than 1 µm and combine electrical and mechanical components. Nanoelectromechanical systems (NEMS) refer to nanoscopic devices that have a characteristic length of less than 1 µm and combine electrical and mechanical components. In mesoscale devices, if the functional components are on the micro- or nanoscale, they may be referred to as MEMS or NEMS, respectively. To put the dimensions and masses in perspective, see Fig. 33.1 and Table 33.1. The acronym MEMS originated in the United States. The term commonly used in Europe and Japan is micro/nanodevices, which is used in a much broader sense. MEMS/NEMS terms are also now used in a broad

sense. A micro/nanosystem, a term commonly used in Europe, is referred to as an intelligent miniaturized system comprising sensing, processing, and/or actuating functions. Fabrication techniques include top-down methods, in which one builds down from the large to the small, and the bottom-up methods, in which one builds up

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