Upcoming Conferences
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PRODUCTIVITY 7FAM
Inficon instruments monitor, control, and fine-tune your processes, so you can improve your product quality and yield.
1 VACUUM (3Al/GfS I 0j0t
Measure the entire vacuum range with a single, microprocessorbased, digital controller, offering all 4 major measuring technologies in a modular design that uses less rack space.
7 RESIDUAL (3AS /..ANALYZERS Monitor, diagnose, and precisely control all vacuum processes (sputtering, etching, evaporation, and CVD) with the Quadrex family of Residual Gas Analyzers, preferred by the semiconductor industry for their accuracy and easy-to-use software features.
7i HELIUM IfAK J. VETECTORS Begin leak testing your system in 3 minutes from start-up with the portable, turbo-pumped UL 100. Its counterflow technology permits full sensitivity testing with minimum operator skill. Inficon advanced technology precise, practical, affordable.
IHINFICON ALEYBOLD COMPANY
6500 Fly Road East Syracuse, NY 13057 (315) 437-0377 See us at the Materials Research Society Show Booth No. 207
UPCOMING CONFERENCES Engineering Foundation Issues Call for Papers on Modeling of Casting and Welding Processes The fourth annual conference on Modeling of Casting and Welding Processes will be held in Palm Coast, Florida, April 1722, 1988. As in previous years, the conference will facilitate the interchange of information among government, industrial, and academic researchers interested in solidification modeling. Abstracts are requested on heat flow, stress and strain, advanced processing, ingots, traditional castings, near-net-shape castings, welding, pre- and post-processing, high speed computation, artificial intelligence, "expert" systems, "special effects" output, and experimental verification. Several tutorial sessions and a panel discussion are planned. A 3D casting will be made by Prof. G.J. Abbaschian (University of Florida), and a cash award will be given for the best simulation. The preliminary program is as follows: • Heat flow analyses for conventional ingots and castings • Heat flow analyses of welding processes • Analysis of near-net-shape processing methods • Analysis of stress/deformation during solidification • Fluid flow in casting/weldments • Advanced solidification processing methods • Experimental correlations • CAD/CAM, CAE, p r e a n d p o s t processing, color and animation • Future directions and needs — panel discussion
Submit TMS format abstracts by October 15, 1987 to Anthony F. Giamei, MS-22, United Technologies Research Center, Silver Lane, East Hartford, CT 06108. Abstracts will be accepted through two weeks following the deadline. Conference fees, including registration, accommodation, meals, etc. range from $700 to $795. For further information contact the Engineering Foundation, 345 East 47th Street, New York, NY 10017; telephone (212) 705-7835; cable ENGFOUND NEW YORK; telex 126022.
Electroceramics Meeting Scheduled for King's College The Basic Science Section of the Institute of Ceramics (Shelton House, Shelton, Stoke-on-Trent, UK) wil
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