Microelectronics Packaging and Integration
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Microelectronics Packaging and Integration
Robert H. Reuss and Babu R. Chalamala, Guest Editors Abstract The focus of this issue of MRS Bulletin is to explore the impact of materials science and technology on microelectronics packaging and integration. Progress in microelectronics packaging has been intimately tied to the continuous advances made in the associated materials, process technologies, and design tools. This is especially true now, as packaging moves into an era driven by the need for complex system-level solutions. This issue is our attempt to present the current status of microelectronics packaging technology and integration and to highlight various perspectives on the future evolution of the field. Keywords: microelectronics packaging and integration, microelectronic materials, technology roadmaps.
Introduction The intent of this issue of MRS Bulletin is to review a range of microelectronics packaging challenges and the associated integration issues. Historically, microelectronics packaging has been driven primarily by the needs of the high-performance computing industry. However, with the advent of portable consumer electronics as the major application driver, the requirements for microelectronics packaging have been rapidly diversifying. This is especially true in the case of wireless and hand-held devices, where low-power and highperformance device technology coupled with cost sensitivity has resulted in a redefining of the role of infrastructure in microelectronics packaging. The result has been a greater push toward the rapid adaptation of system-in-a-package (SiP) solutions. Even in the case of highperformance computing, interconnects and packaging are reaching a critical point wherein interconnects, assembly, and packaging have become a significant factor in determining the cost and overall system performance of the device or module. While our primary objective is to present a review of the status and future directions of various microelectronics packaging technologies, we can cover only a small
MRS BULLETIN/JANUARY 2003
spectrum of the many important topics. Microelectronics packaging is a diverse subject driven by the needs of myriad applications. For example, the packaging needs of high-performance microprocessors are quite different from those of hand-held devices like personal digital assistants (PDAs) and cellular telephones. However, most applications share the need for low power consumption, high performance, and low manufacturing cost. Along with high-performance computing, emerging applications in communications, transportation, and consumer electronics require enhanced packaging capabilities. Other important applications such as optical microelectromechanical systems (MEMS), storage devices, and medical electronics have their own unique sets of packaging requirements. We invited a number of leading materials and device technologists to provide their views of critical aspects of microelectronics packaging and to offer their insights on future directions, especially on the material
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