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MULTI-LEVEL DAMASCENE PROCESS DEVELOPMENT: ALUMINUM CMP David A. Hansena, Gerry Moloneya and Alex Reyesa Cybeq Nano Technologies, San Jose, CA a Present Affiliation: Multi Planar Technologies, Inc, San Jose, CA ABSTRACT The purpose of this work was to investigate integration of aluminum multi-level damascene devices with the CMP module. Traditionally aluminum is used in the Metal-1 level of device manufacturing and Reverse Ion Etching (RIE) is used to remove the aluminum over layer. However for

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