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ACKNOWLEDGEMENT The authors are thankful to Valerie Chapman of Semitest Corporation, MA for SCA measurements on the samples. Financial aid from National Science Foundation is also acknowledged.

REFERENCES 1. 2. 3. 4. 5. 6. 7. 8. 9.

D.A. Buchanan, IBM J. Res. Develop. 43, p. 245 (1999). G. Lucovsky, J. Vac. Sci. Tech. A 17, p. 1340 (1999) G. Lucovsky, IBM J. Res. Develop. 43, p. 301 (1999). V. Misra, H. Lazar, Z. Wang, Y. Wu, H. Niimi, G. Lucovsky, J.J. Wortman, and J.R. Hauser, J. Vac. Sci. Tech. B 17, p. 1836 (1999). T.P. Ma, Appl. Surf. Sci. 117/118, p. 259 (1997). T.P. Ma, IEEE Trans. Elect. Devices 45, p. 680 (1998). M.M. Moslehi and K.C. Saraswat, IEEE Trans. Elect. Devices 32, p. 106 (1985). H. Shin, S. Choi, T. Hwang, K. Lee, J. Korean Phy. Soc. 33, p. S175 (1998). S.A. Ajuria, J.T. Fitch, D. Workman, and T.C. Mele, J. Electrochem. Soc. 140, p. L113

(1993). 10. C.M. Kohn and W.C. Goldfarb, Solid St. Tech., June (1995).

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