Power Electronic Packaging Design, Assembly Process, Reliability and
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces
- PDF / 27,874,870 Bytes
- 605 Pages / 439.37 x 666.142 pts Page_size
- 54 Downloads / 302 Views
Yong Liu
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Yong Liu Fairchild Semiconductor Corporation South Portland, ME, USA
ISBN 978-1-4614-1052-2 e-ISBN 978-1-4614-1053-9 DOI 10.1007/978-1-4614-1053-9 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2011945852 # Springer Science+Business Media, LLC 2012
All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Preface
Since Fairchild introduced the first commercially viable integrated circuit in Silicon Valley in 1957, the semiconductor industry has made impressive progress, particularly in communications, health, automotive, computing, consumer, security, and industrial electronics. This progress has followed Moore’s Law, which predicts IC miniaturization down to nano dimensions and system-on-chip integration. At the same time, there are technologies based on or derived from silicon that do not scale according to Moore’s Law such as RF, power electronics, sensors, MEMS, and lighting. These technologies are called “More than Moore.” Along with technology development trends characterized by Moore’s Law and “More than Moore,” business trends are characterized by cost reduction, shorter product life cycles, and outsourcing. The combination of these technology and business trends leads to increased design complexity, decreased design margins, increased probability of failures, decreased product development and qualification time, and challenges in assembly manufacturing. The quality and reliability of the assembly manufacturing process is critical in assuring a successful product. It is important to recognize that concurrent engineering of the semiconductor content and its high performance power package is becoming increasingly dependent on the rigorous use of proven multi-physics/FEA tools and techniques. The correct use of modeling tools can shorten power package design cycles but the challenge is insuring that the modeling tools and methodologies can support next generation products. Models for power packaging designs, materials, reliability and assembly manufacturing processes include electromigration simulation; diffusion along the interface of two metal materials; contamination at the interface between the lead frame, multiple chips, a
