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Kazuo Kondo Rohan N. Akolkar Dale P. Barkey Masayuki Yokoi Editors

Copper Electrodeposition for Nanofabrication of Electronics Devices

Nanostructure Science and Technology Volume 171

Series editor David J. Lockwood, Ottawa, Canada

For further volumes: http://www.springer.com/series/6331

Kazuo Kondo Rohan N. Akolkar Dale P. Barkey Masayuki Yokoi •

•

Editors

Copper Electrodeposition for Nanofabrication of Electronics Devices

123

Editors Kazuo Kondo Department of Chemical Engineering Osaka Prefecture University Osaka Japan

Dale P. Barkey Department of Chemical Engineering University of New Hampshire Durham, NH USA

Rohan N. Akolkar Intel Corporation Hillsboro, OR USA

Masayuki Yokoi Industrial Technology Support Institute Osaka Japan

ISSN 1571-5744 ISBN 978-1-4614-9175-0 DOI 10.1007/978-1-4614-9176-7

ISSN 2197-7976 (electronic) ISBN 978-1-4614-9176-7 (eBook)

Springer New York Heidelberg Dordrecht London Library of Congress Control Number: 2013954032  Springer Science+Business Media New York 2014 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. Exempted from this legal reservation are brief excerpts in connection with reviews or scholarly analysis or material supplied specifically for the purpose of being entered and executed on a computer system, for exclusive use by the purchaser of the work. Duplication of this publication or parts thereof is permitted only under the provisions of the Copyright Law of the Publisher’s location, in its current version, and permission for use must always be obtained from Springer. Permissions for use may be obtained through RightsLink at the Copyright Clearance Center. Violations are liable to prosecution under the respective Copyright Law. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. While the advice and information in this book are believed to be true and accurate at the date of publication, neither the authors nor the editors nor the publisher can accept any legal responsibility for any errors or omissions that may be made. The publisher makes no warranty, express or implied, with respect to the material contained herein. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)

Preface

Copper has lower resistivity than aluminum and can be electrodeposited easily. Hence, copper can be used for chip wiring. In 1998, the copper damascene on-chip interconnect process was introduced comme