Floating Gate Devices: Operation and Compact Modeling
Floating Gate Devices: Operation and Compact Modeling focuses on standard operations and compact modeling of memory devices based on Floating Gate architecture. Floating Gate devices are the building blocks of Flash, EPROM, EEPROM memories. Flash memories
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		    Floating Gate Devices: Operation and Compact Modeling by
 
 Paolo Pavan DII – Università di Modena e Reggio Emilia, Italy
 
 Luca Larcher DISMI – Università di Modena e Reggio Emilia, Italy and
 
 Andrea Marmiroli STMicroelectronics, Central R&D, Italy
 
 KLUWER ACADEMIC PUBLISHERS NEW YORK, BOSTON, DORDRECHT, LONDON, MOSCOW
 
 eBook ISBN: Print ISBN:
 
 1-4020-2613-7 1-4020-7731-9
 
 ©2004 Springer Science + Business Media, Inc. Print ©2004 Kluwer Academic Publishers Dordrecht All rights reserved No part of this eBook may be reproduced or transmitted in any form or by any means, electronic, mechanical, recording, or otherwise, without written consent from the Publisher Created in the United States of America
 
 Visit Springer's eBookstore at: and the Springer Global Website Online at:
 
 http://www.ebooks.kluweronline.com http://www.springeronline.com
 
 Contents
 
 Contributing Authors
 
 ix
 
 Preface
 
 xi
 
 Foreword
 
 xv
 
 1. INTRODUCTION
 
 1
 
 1.
 
 COMPACT MODELING General concepts and definitions The Compact Modeling of a Floating Gate Device 2. SEMICONDUCTOR MEMORIES 3. FLOATING GATE DEVICES 4. FIRST COMMERCIAL DEVICES AND PRODUCTS 5. EVOLUTION 6. APPLICATIONS AND MARKET CONSIDERATIONS 6.1 Applications 6.2 Market highlights REFERENCES 1.1 1.2
 
 2. PRINCIPLES OF FLOATING GATE DEVICES 1. 1.1 1.2 1.3 1.4 1.5
 
 TECHNOLOGY HIGHLIGHTS Introduction Lithography Field isolation Silicon oxidation Ion Implantation, Deposition, Etching, Chemical Mechanical Polishing, Metallization v
 
 1 2 4 6 7 9 10 12 12 13 14
 
 17 17 17 18 21 22 22
 
 vi
 
 CONTENTS 2.
 
 CELL OPERATION Charge injection mechanisms Channel Hot Electron current CHannel Initiated Secondary ELectron current Fowler-Nordheim Tunneling Current 3. DISTURBS AND RELIABILITY 3.1 Programming Disturbs 3.2 Retention 3.3 Endurance 3.4 Erase Distribution 3.5 Scaling issues REFERENCES 2.1 2.2 2.3 2.4
 
 3. DC CONDITIONS: READ 1.
 
 TRADITIONAL FG DEVICE MODELS 1.1 The classical FG voltage calculation method 1.2 Drain current calculation 1.3 Limits of the capacitive coupling coefficient method 1.3.1 The capacitive coupling coefficient extraction procedure 1.3.2 The bias dependence of the capacitive coupling coefficients 2. THE CHARGE BALANCE MODEL 2.1 The Floating Gate voltage calculation procedure 2.2 Advantages and scalability 2.3 Parameter extraction 3. SIMULATION RESULTS REFERENCES
 
 4. TRANSIENT CONDITIONS: PROGRAM AND ERASE 1. 2.
 
 MODELS PROPOSED IN THE LITERATURE THE CHARGE BALANCE MODEL: THE EXTENSION TO TRANSIENT CONDITIONS 3. FOWLER-NORDHEIM CURRENT 3.1 Theory and compact modeling 3.1.1 Charge quantization effects on oxide barrier height 3.1.2 The oxide field calculation 3.2 Simulation Results 4. CHANNEL HOT ELECTRON CURRENT 4.1 Theory and Compact Modeling 4.1.1 The “lucky-electron” model 4.1.2 Alternative CHE current models 4.2 Simulation Results 4.3 CHISEL current modeling REFERENCES
 
 24 24 25 27 27 29 30 30 32 32 33 34
 
 37 37 38 39 40 41 42 43 45 46 46 47 54
 
 57 57 60 61 61 63 65 70 74 74 75 77 80 82 83
 
 CONTENTS
 
 vii
 
 5. FURTHER POSSIBILITIES OF FG DEVICE COMPACT MODELS 87 1.
 
 RELIABILITY PREDICTI		
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