Three Dimensional System Integration IC Stacking Process and Design
Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well
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Antonis Papanikolaou Dimitrios Soudris Riko Radojcic ●
Editors
Three Dimensional System Integration IC Stacking Process and Design
Editors Antonis Papanikolaou Department of Electrical and Computer Engineering National Technical University of Athens 157 80 Athens Zographou Campus Greece [email protected]
Dimitrios Soudris Department of Electrical and Computer Engineering National Technical University of Athens 157 80 Athens Zographou Campus Greece [email protected]
Riko Radojcic Qualcomm Inc. San Diego, CA USA [email protected]
ISBN 978-1-4419-0961-9 e-ISBN 978-1-4419-0962-6 DOI 10.1007/978-1-4419-0962-6 Springer New York Dordrecht Heidelberg London © Springer Science+Business Media, LLC 2011 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Contents
1 Introduction to Three-Dimensional Integration................................... Antonis Papanikolaou, Dimitrios Soudris, and Riko Radojcic
1
2 TSV-Based 3D Integration...................................................................... James Burns
13
3 TSV Characterization and Modeling..................................................... Michele Stucchi, Guruprasad Katti, and Dimitrios Velenis
33
4 Homogeneous 3D Integration................................................................. Robert Patti
51
5 3D Physical Design................................................................................... Jason Cong and Guojie Luo
73
6 Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs........................................................................... 103 Young-Joon Lee, Michael Healy, and Sung Kyu Lim 7 PathFinding and TechTuning.................................................................. 137 Dragomir Milojevic, Ravi Varadarajan, Dirk Seynhaeve, and Pol Marchal 8 3D Stacking of DRAM on Logic............................................................. 187 Trevor Carlson and Marco Facchini 9 Microprocessor Design Using 3D Integration Technology................... 211 Yuan Xie 10 3D Through-Silicon Via Technology Markets and Applications......... 237 E. Jan Vardaman Index.................................................................................................................. 243 v
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